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ElecGearAnti-Bending Contact Frame for Intel 13th and 12th CPU, Aluminum Mod ILM for LGA1700 Socket, Replacement CPU Retrofit Kit Fixing Buckle and Thermal Paste
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About the item
- [Intel 13th and 12th LGA1700 Mod Bracket] – The contact frame together with the elastic ket inside evenly distributes the pressure on the entire edge of IHS. The precision CNC machined frame ensures CPU is perfectly flat when installed in LGA1700-BCF socket, preventing it from flexing the middle down. Anodized 7075 aluminum delivers the most strength. The insulating pads and the ket are made of materials which withstand 130℃ high temperature for most stability.
- [Bending Issue of Raptor Lake and Alder Lake] – The 13th and 12th gen Intel Core CPU elongated its IHS and the stock LGA-1700 ILM placed tremendous pressure on the middle of CPU that causes the top to bend or warp. Some famous IT publisher reported this bending or warping deflection increases CPU temperatures by 5℃. Intel insists the deflection isn't a problem, but PC enthusiasts won't agree with the poor contact with a warped processor and higher temp.
- [Thermal Paste] – Specially customized thermal compound is the ideal CPU heatsink grease with high thermal conductivity (6.5W/m-K), low thermal resistance, metal-free, non-bleeding and easy to apply. T20 trox screwdriver included for easy teardown and assembly.
Frequently Asked Questions About ElecGearAnti-Bending Contact Frame for Intel 13th and 12th CPU, Aluminum Mod ILM for LGA1700 Socket, Replacement CPU Retrofit Kit Fixing Buckle and Thermal Paste in Dominica
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